Tianyongcheng was shortlisted - [Cheqian Release] 5G Communication "High thermal conductivity interface material supplier" research list

5G construction has become the most important part of the "new infrastructure". Compared with 4G, the requirements for heat dissipation of base stations and terminal equipment have been continuously improved. The volume of integrated circuit chips and electronic components has been shrinking, and the power density has increased rapidly. Thermal diffusion has become an urgent problem for communication equipment. Thermal conductive interface material is a new material designed for the heat conduction requirements of equipment, As an essential material, high thermal conductivity interface materials are favored by terminals.

As the sponsor of the "3rd 5G base station&data center&terminal thermal management technology forum", Vegan Information is hereby an excellent supplier of high thermal conductivity interface materials for the industry to consult and jointly discuss the 5G heat dissipation problem!

Recommended by 5G communication high thermal conductivity interface material enterprises

Shanghai Arlaide is a supplier of high polymer communication equipment components. Since 2004, it has been committed to providing industry-leading RF and wave transmission protection devices, EMI and IP protection devices and thermal interface materials, providing customers with overall solutions for design, development, production and manufacturing;

Arlaide thermal interface materials have excellent performance characteristics, realize effective heat control, and make electronic equipment work for a long time under stable operating conditions. The company's TGEL series thermal conductive gel has low modulus, low stress, high thixotropy, excellent high temperature resistance, weather resistance and dielectric properties, and the thermal conductivity can be up to 9W/m · K. TPAD series thermal conductivity gasket can provide excellent thermal conductivity and environmental reliability, and the maximum thermal conductivity can reach 30W/m · K, which is suitable for various applications;

Dow Corporation - has developed a series of thermal conductive gel that can respond well to the high heat generated by high power density, such as the Taoxi * TC-4083 thermal conductive gel with a thermal conductivity of up to 10W/mK and high reliability (anti sagging, anti cracking). The thermal conductive gel has a extrusion rate of up to 65G/min and high thermal stability. It is resistant to harsh thermal shock and cold and hot cycle tests. It is suitable for thermal conductive caulking with a thickness of 120um to 3mm in consumer electronics, communications, automotive and other industries, And maintain vertical reliability. There is also a new type of thermal conductive gel suitable for RRU/AAU chips. Compared with thermal conductive mud, it has better reliability, less disassembly force, and is easy to rework. It can be stored at room temperature to help chipsets effectively cool down. There is also the classic Taoxi * TC-4025/4040/4060 dispensing type thermal conductivity gel, with various thermal conductivity of 2.5-6.2W/mK available;

Liqun Lianfa - Our company has been deeply involved in the communication equipment industry for many years. In order to achieve the operation processing capacity matching with 5G, we provide long-term reliable thermal conductivity interface materials with high thermal conductivity, low thermal resistance and stability, which can greatly improve the heat dissipation efficiency of heating components.

Since entering the communication industry in 2014, after two years of technical reserves, 6W single component thermal conductive gel has made a major breakthrough, taking the lead in becoming a national brand that can replace foreign well-known manufacturers, and becoming an important milestone in the localization process in the communication field. Through long-term market verification, its comprehensive performance can surpass foreign brands, and has been highly recognized by industry leaders such as ZTE. In order to actively respond to the national industrial strategy and market demand at home and abroad, our company has continued to increase research and development efforts in recent years, and constantly promoted the updating and iteration of the product system. We have successively launched high-performance heat conduction materials such as 9W single component heat conduction gel, 12W two-component heat conduction gel, 6W two-component heat conduction silicone grease, 7-40W carbon fiber heat conduction gasket, 7W heat conduction and wave absorption material, which are widely used in 5G communication base stations, optical modules, 5G terminals, and ZTE, Huawei Establish good cooperation relationship with head industry customers such as Jingxin;

Deyimeng has three major types of thermal interface materials: thermal conductive gasket, thermal conductive gel and thermal conductive silicone grease. Deyimeng's three major types of thermal interface materials are widely used in the 5G communication field. DeYimeng ST series thermal conductive silicone gasket has good compressibility and meets the requirements of V0 flame retardant, RoHS and low oil permeability. Deyimeng GR series thermal conductive gel maintains good thixotropy fluidity before curing, which is an automated production solution for connecting vulnerable electronic components or uneven components to radiators. DEM G9 series thermal conductive silicone grease is a paste compound of thermal conductive interface material, which is not easy to dry. It can guide heat energy from the heating equipment to the radiator and chassis, and has low permeability, good temperature resistance and low fluidity;

Aiken organosilicon - an enterprise of Sinochem. A unique whole-industry chain integration company that fully integrates the production of quartz to high-end special silicone products, has the leading position in the Chinese market and the expertise in the global silicone market, and is committed to providing customers with "unique personalized services". BLUESIL and CAF can provide a complete set of solutions for 5G communication from heat conduction, heat insulation, bonding and sealing;

Honeywell Honeywell thermal interface materials provide highly reliable heat dissipation solutions for the communication industry. Among them, phase change materials and thermal conductive gel can help engineers effectively solve the thorny heat dissipation problems of devices, and improve the heat dissipation efficiency and design flexibility of devices; Its thermal conductivity ranges from 2 to 8.0 W/mK, providing a variety of options for thermal management engineers;

Rezdun - focuses on the R&D, production and sales of high-performance electromagnetic shielding, thermal management and adhesive materials, and its products are widely used in communication, automobile and other fields. Flextein S series is a gap filler material with ultra-high thermal conductivity, with thermal conductivity ranging from 1.0 to 15.0W/m.k. It is specially designed for applications with high power consumption, high heat and high performance.

The potting adhesive used by our company for heat conduction and bonding of heat pipes and fins of even stable radiators has the characteristics of low viscosity and anti-hardening, the bonding strength is more than 10MPa, and the heat resistance and aging resistance are excellent; The thermal conductive structural adhesive used for fixing chips and IGBT radiators has excellent thermal conductivity and bonding effect;

Wacker Chemical - Wacker provides thermal conductive adhesive, joint filler, silicone grease and silicone potting adhesive. The products involve many industries such as automobile and electronics. Efficient thermal management is essential to extend the life of key electronic components. SEMICOSIL ?  TC products can meet customers' requirements for high thermal conductivity, low thermal resistance and excellent processing performance;

Laird high-performance materials - the electronic interconnection technology under DuPont Electronics and Industry Division, is a leading global leader in heat conduction and electromagnetic shielding technology, providing comprehensive solutions for electronic application protection. We solve design problems through various products and technologies, such as electromagnetic shielding, wave absorbing materials, thermal conductive interface materials, precision metals and integrated multi-functional solutions. Among them, the multi-functional solution product series can solve many technical problems at the same time. We provide solutions for all industries, including: automotive, aerospace, medical, computer, data infrastructure, telecommunications, testing and measurement, wearable devices and electronic game market;

Henkel - provides a variety of interface thermal conductive materials (TIM) solutions for a variety of applications, and improves the system performance and the reliability of high power density line cards through effective thermal management. Various formulas of thermal conductive gasket, adhesive film, liquid thermal conductive material and thermal conductive gel help to improve the device cooling effect and efficiency of next-generation network devices and high-performance computing servers;

Tianyongcheng Polymer - Tianyongcheng is committed to providing leading silicone, polyurethane, acrylic acid and other series products and application technologies for the global 5G communication industry to meet the different needs of global customers. The company's main products are: thermal conductive gel, thermal conductive potting glue, thermal conductive gasket, thermal conductive silicone grease, silicon gel; Polyurethane structural adhesive, potting adhesive, sealant, etc. The thermal conductivity of the thermal conductive adhesive ranges from 0.7-6W/mK, which is suitable for various thermal management scenarios of customers;

Feirongda has been deeply involved in the field of communication for more than 20 years, and has developed a series of thermal conductive interface materials to comprehensively solve various interface heat conduction problems of 5G communication equipment. These include sheet heat conduction gap filling materials (such as heat conduction gaskets with a thermal conductivity of up to 8-10w/m.k, thermal insulation sheets with a thermal resistance as low as 0.25 ℃/in2. w), liquid heat conduction gap filling materials (such as single component heat conduction gel with a thermal conductivity of up to 6w/m.k, two-component curable heat conduction gel with a low volatility of 3.5w/m.k), phase change heat conduction interface materials (4.2w/m.k plug resistant materials with PI film), etc. The high thermal conductivity, low thermal resistance, good long-term reliability and convenient installation and operation of the product are the goals that we have been pursuing, and we have been doing so;

Zhongdi New Material - provides a professional thermal management system solution for the 5G communication industry. The 3~10W/mK thermal conductive material is mature and has achieved mass production. Among them, thermal conductive dispensing, thermal conductive gasket and thermal conductive silicone grease can be specially developed by customers. Zhongdi thermal conductive gasket and thermal conductive adhesive have the characteristics of high thermal conductivity, high compression resilience, low siloxane, low permeability oil, etc., which are stable and reliable, and are also supported by mature and excellent automatic dispensing equipment manufacturers at home and abroad; And on-site or remote technical services of the company's 24-hour rapid response mechanism;

GLpoly - focuses on the research, development and production of insulating and thermal conductive interface materials. The thermal conductivity of XK-P thermal conductive silicon film can reach up to 11w/m * k, the thermal conductivity of XK-G thermal conductive gel can reach up to 10w/m * k, vehicle specification quality, service life of more than 10 years, with the advantages of high thermal conductivity, low oil production, low volatility, high reliability, etc., which has been widely used in 5G/6G communication modules, automotive electronics, L3-L5 auto drive system, millimeter wave radar equipment, etc;

Hongfucheng is a specialized new enterprise focusing on thermal management materials, providing a series of thermal management material solutions for 5G communication field: carbon fiber thermal conductive gasket, thermal conductive gel, low oil yield thermal conductive gasket, phase change thermal conductive materials, thermal conductive and wave absorbing materials, etc. Product features: high K value, low thermal resistance, high reliability, automation... The whole series meets the specific needs of customers. It has more than 150 patents and has won international awards such as the International RD100 Research and Development Award, the Edison Invention Award, the CES Innovation Award, etc;

3M - As a leading enterprise in the electronic materials industry, 3M provides a full range of thermal interface materials for 5G communication base station equipment, including thermal conductive tape, thermal conductive structural adhesive, non silicon thermal conductive gasket, non silicon thermal conductive gel and thermal conductive wave absorbing materials, which are used for bonding devices and gap filling in 5G communication base station equipment. The unique formula design not only helps 5G communication base stations and devices to dissipate heat, but also meets the requirements of different assembly processes, structural strength, electromagnetic performance and reliability according to different application scenarios;

Sanyuan Electronics - provides diversified thermal conduction solutions for the 5G communication industry. Including high thermal conductivity curable gel series, with thermal conductivity above 8W/m.K, which can achieve low interface thermal resistance under low pressure; High thermal conductivity gasket series, thermal conductivity 13-18W/m.K; High thermal conductivity wave absorption series, thermal conductivity 6-11 W/m.K, can effectively suppress resonance, electromagnetic leakage and other problems in the frequency range of 0.1~8 GHz; Thermal conductivity phase change series, thermal conductivity 4-8 W/m.K; It can match multiple application scenarios;

Yunnan Zhongxuan Liquid Metal - Zhongxuan Liquid is committed to providing overall solutions for customers' thermal management needs, and has developed a series of liquid metal thermal interface materials, such as liquid metal thermal conductive paste, liquid metal thermal conductive film and liquid metal composite thermal conductive silicone grease, with ultra-high thermal conductivity and high reliability. At the same time, it can provide "customized" reliable liquid metal packaging solutions according to customer application scenarios;

Comet crystal new materials - provide perfect thermal management scheme and materials for 5G communication applications. It includes high-performance thermal conductive interface materials that meet different scenarios (1~17W/m · k thermal conductive gasket, 2~14W/m · k thermal conductive gel, 300MHz~100GHz wave absorber and 1~6W/m · k thermal conductive wave absorber). At the same time, in order to meet the diversity of high heat dissipation needs, Comet Crystal New Materials can provide die-casting aluminum with high strength, high toughness, high heat conduction and other characteristics, as well as high-quality, cost-effective comprehensive heat dissipation solutions, Realize the substitution of localized materials and technologies in the key heat conduction and heat dissipation technology fields, and solve the "neck" problem;

Suzhou Safid - Safid is committed to solving various heat dissipation problems. Its products include thermal pad, gap filler, thermal grease and other interface materials and adhesives. It also has silicon-free and low-volatile products, and has quite mature experience in various fields;

Zhongshi Technology - Beijing Zhongshi Weiye Technology Co., Ltd. has the world's leading technology in the field of thermal conductivity solutions and electromagnetic shielding materials. It focuses on core materials and components, providing functional materials such as graphite materials, thermal conductivity interface materials, EMI shielding materials, and advanced thermal management solutions based on core technologies such as two-phase flow and liquid cooling; Provide vertical integration solutions for thermal management for consumer electronics, digital infrastructure, intelligent transportation, clean energy and other high-growth industries, and strive to become a leading global supplier of functional materials and thermal management solutions;

Shenzhen Mingfen Electronics - focuses on the sales of thermal management materials, covering the fields of microwave radio frequency, semiconductor, optoelectronics, new energy and other fields. Its main products include diamond copper, diamond aluminum, copper clad lead, thermal conductivity bonding, thermal conductivity potting adhesive, thermal conductivity caulking adhesive, nano sintered silver adhesive and other thermal conductivity bonding materials. With excellent CTE matching, it is committed to providing customers with a series of thermal management solutions;

Shenzhen Bowen Industry, founded in 2004, is a national high-tech enterprise integrating R&D, production and sales. Its main products are thermal interface materials and insulating materials, including phase change thermal conductive film, thermal conductive silicone grease, thermal conductive gel, polyurethane thermal conductive structural adhesive, carbon fiber thermal conductive gasket, thermal curing adhesive film, wave absorbing gasket, etc. It is a leading and professional thermal conductive solution service provider in China, Products are widely used in power electronics, new energy, communications, automotive electronics, household appliances and other industries. The company has formed long-term and stable partnership with many international top 500 enterprises;

Shenzhen thermoacoustic intelligence - thermoacoustic intelligence has recently developed a new Gel-80s high thermal conductivity gel for the application of electronic components of communication equipment, with a thermal conductivity of up to 8W/m-K. The single component high thermal conductivity gel can provide powerful heat transfer effect for high-power electronic components, thus improving the operating efficiency of the system and enhancing its reliability throughout the cycle. The product has ultra-high flow rate, the extrusion rate is 2-3 times that of the current imported brands, and the automatic dispensing efficiency is high. For 5G telecom infrastructure equipment, data center switches, routers, servers, and industrial automation electronic equipment, it has good thermal conductivity. At the same time, our company provides two-component structural adhesive, which has the functions of thermal insulation, super bonding and sealing. It can replace bolt components, simplify structure and reduce weight;

Suzhou Simaic - The company launched a series of high thermal conductivity interface materials for 5G communication, including thermal conductive silica gel sheet, thermal conductive silicone grease, thermal conductive gel, etc. The thermal conductivity coefficient can be selected from 1.2 W/m.k to 12 W/m ? K, with good surface wettability, softness, compressibility, soft surface with micro viscosity, which can closely fit with parts for heat transfer. The product has passed UL94 V0 and RTI 150 ° C certification. Widely used in automobile, home appliance, communication, consumer electronics and other fields;

Shenzhen Hanhua Thermal Management - Shenzhen Hanhua is fully committed to the R&D, production and technical services of thermal management schemes, new thermal conductivity materials, thermal diffusion materials and thermal conductivity modules. Main products: thermal conductivity interface material, conductive material, shielding material, thermal conductivity and wave absorption material, thermal insulation material, 5G RF anti-interference thermal conductivity material, artificial high power